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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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| Press Release |
June 12, 2026 - Click the title to read the full press release.
CEA Leti reaffirmed its long standing collaboration with GlobalFoundries (GF), whose ongoing participation in the FAMES Pilot Line as an end user is advancing more than two ...
CEA Leti
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High-force flip-chip bonding with Tresky
Swiss made and semi-automatic, the new high-force die bonder 5500 from Tresky can bond with forces up to 1000 N. That's corresponding to 100 kg bond force!
Dr. Tresky AG
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