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1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG
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| Press Release |
June 12, 2026 - Click the title to read the full press release.
Energy efficiency, faster processing and permanent data storage: In collaboration with GlobalFoundries, research scientists at the Fraunhofer Institute for Photonic Microsystems ...
Fraunhofer IPMS
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Nordson Sight™
Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields.
Nordson Test & inspection
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