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Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
Brewer Science
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| Press Release |
June 3, 2026 - Click the title to read the full press release.
As an industry leader in innovative materials solutions for critical RF/microwave applications, Indium Corporation® will highlight its high-reliability, gold-based precision die-attach ...
Indium Corporation
June 5, 2026
Indium Corporation, Ames National Laboratory Team Up to Establish U.S. Gallium Supply Chain
Indium Corporation® and Ames National Laboratory have announced a research and development partnership to expand U.S. production of gallium, a critical material used ...
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June 4, 2026
Breaking Thermal Barriers: Indium to Present Metal TIMs Solutions for Next-Gen Electronics at FINE 2026
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how advanced metal thermal interface materials (TIMs) can achieve new performance thresholds ...
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June 3, 2026
Indium Corporation to Feature AuLTRA® Die-Attach Solutions at IMS 2026
As an industry leader in innovative materials solutions for critical RF/microwave applications, Indium Corporation® will highlight its high-reliability, gold-based precision die-attach ...
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June 2, 2026
Indium Corporation Brings AI-Enabling Power Electronics Solutions to PCIM Expo
As a leading provider of high-reliability materials for all power electronics devices, Indium Corporation® will showcase its AI-enabling portfolio of products at PCIM Expo 2026 ...
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May 29, 2026
Indium Experts Address Power Electronics and Thermal Management Solutions at PCIM Expo 2026
Indium Corporation® will feature three experts addressing critical industry challenges at PCIM Expo 2026, June 9-11, in Nuremberg, Germany. Improving Thermomechanical Reliability ...
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May 28, 2026
Indium Corporation Receives ASE Technology Sustainability Award
Indium Corporation® received a Sustainability Award from ASE Technology Holding Co., Ltd. (ASE) at their recent 2025 Best Suppliers Award Ceremony in Taichung, Taiwan. ...
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May 26, 2026
Indium Corporation to Highlight Power Device Packaging Solutions at ECTC 2026
As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will showcase its high-reliability portfolio of products ...
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May 19, 2026
Indium to Present on Metal TIMs Solutions for Demanding Thermal Environments at CSPT
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how metal thermal interface materials (TIMs) can unlock the full performance potential of next-generation ...
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May 18, 2026
Indium Corporation Expert to Present sTIMs Solution for AI Thermal Challenges at IEEE ECTC
Indium Corporation® Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder thermal ...
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May 14, 2026
Indium Corporation Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical ...
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| Sponsor |
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Chemically Resistant, UV Curable Epoxy
Master Bond UV26SP is a low outgassing UV curing system with high temperature and chemical resistance for bonding, sealing and coating.
Master Bond
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