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1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG
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| Press Release |
May 29, 2026 - Click the title to read the full press release.
Lumissil Microsystems announced the IS32FL3776 matrix LED driver for software-defined exterior lighting module applications. These systems use matrix LED patterns ...
Lumissil Microsystems
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Nordson Sight™
Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields.
Nordson Test & inspection
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