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IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group

Press Release

May 28, 2026 - Click the title to read the full press release.

From sensors to software: ADAS market accelerates toward $66 billion

Yole Group announces the release of its latest market and technology report, Automotive ADAS 2026, providing a comprehensive analysis of a rapidly evolving industry ...

Yole Group

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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH