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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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| Press Release |
May 27, 2026 - Click the title to read the full press release.
FUJIFILM Corporation announced that it will present new semiconductor packaging research findings and exhibit its ZEMATES product line of photosensitive insulating ...
FUJIFILM Corporation
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