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IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group

Press Release

May 27, 2026 - Click the title to read the full press release.

Fujifilm presents latest advanced packaging research results and will introduce PFAS-free PBO at ECTC 2026

FUJIFILM Corporation announced that it will present new semiconductor packaging research findings and exhibit its ZEMATES product line of photosensitive insulating ...

FUJIFILM Corporation

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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH