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1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG
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| Press Release |
May 22, 2026 - Click the title to read the full press release.
Advanced Thermal Solutions, Inc. (ATS) now offers the ATS Engineering Subscription Program, providing on-demand access to senior-level thermal engineers to solve ...
Advanced Thermal Solutions, Inc.
May 22, 2026
ATS Thermal Engineering Subscription Program Provides Ongoing Engineering Support for OEM Needs
Advanced Thermal Solutions, Inc. (ATS) now offers the ATS Engineering Subscription Program, providing on-demand access to senior-level thermal engineers to solve ...
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October 13, 2025
New ATS Thermal Transfer Plates Help Optimize NVIDIA Jetson™ Modules Performance
Advanced Thermal Solutions, Inc. (ATS) has introduced a series of thermal transfer plates (TTPs) designed for optimizing NVIDIA Jetson Orin Nano, Orin NX, Nano, and Xavier NX ...
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January 11, 2021
ATS Releases Portable and Freestanding Freezers for Vaccines, Biomedical
The Vostok series of ultra-low temperature freezers from Advanced Thermal Solutions, Inc.(ATS) can continuously store biological materials, including vaccines at temperatures ...
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August 30, 2017
ATS Platform Products Provide Cost-Effective Solutions at High Airflow
Advanced Thermal Solutions, Inc. (ATS) has a family of Pin Fin heat sinks designed as cost-effective solutions for systems with adequate airflow. The high aspect ...
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Nordson Sight™
Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields.
Nordson Test & inspection
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