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Sponsor
Henkel-AG-Co

Is copper sintering the future of WBG semiconductors?
Silver dominates today, but copper is catching up fast. Explore the cost, reliability, and sustainability shifts reshaping GaN and SiC die attach technology.
Henkel AG & Co.
Uyemura
Press Release
May 13, 2026  -  Click the title to read the full press release.

Siemens unveils AI-powered library characterization to accelerate semiconductor design



Siemens announced Solido™ Characterizer software, the next evolution in its Solido™ Characterization Suite software, designed to meet the semiconductor industry's rapidly ...

Siemens
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Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
Intraratio-Corporation