| Sponsor |
|
Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology
|
|
| Press Release |
May 5, 2026 - Click the title to read the full press release.
STMicroelectronics has introduced two 100-Watt VIPerGaN high-voltage converters, extending wide-bandgap energy savings throughout domestic appliances, building and home ...
STMicroelectronics
July 8, 2026
STMicroelectronics unveils world's first ST54M secure mobile chip
STMicroelectronics has introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready ...
|
June 22, 2026
STMicroelectronics unveils new compact direct Time-of-Flight 3D LiDAR module
STMicroelectronics announced the launch of the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module that sets a new benchmark in high-resolution sensing. ...
|
June 17, 2026
STMicroelectronics' multiplier-less PFC controller enhances cost-sensitive, energy-efficient applications
STMicroelectronics' L6462A transition-mode (TM) power-factor correction (PFC) controller cuts bill-of-materials (BOM) costs while enhancing efficiency, enabling consumer ...
|
June 11, 2026
STMicroelectronics expands ST87M01 NB-IoT module platform with certifications for North America and Brazil
STMicroelectronics has completed certification of ST87M01 NB-IoT modules in North America and Brazil, letting IoT projects in both regions leverage the modules' 5G-ready ...
|
June 8, 2026
STMicroelectronics' 48V automotive pre-driver combines ISO 21780 compliance with 8-channel flexibility
With an absolute maximum rating (AMR) of 75V, STMicroelectronics’ L98GD8E is the only 48V automotive pre-driver to combine compliance with the ISO 21780 standard ...
|
June 2, 2026
STMicroelectronics raises its revenue ambition for Data Centers amidst continued strong demand for AI infrastructure
In light of continued strong AI infrastructure-led demand and based on recent progress made on capacity ramp-up, STMicroelectronics is raising its revenue ambition ...
|
May 29, 2026
STMicroelectronics' automotive inertial module boosts positioning and motion sensing accuracy
STMicroelectronics' ASM330LHHG1 automotive-qualified inertial measurement unit (IMU), which operates from -40°C to 125°C, can be mounted in vehicle zones including ...
|
May 27, 2026
STMicroelectronics' new GaN semiconductors improve energy efficiency
New gallium nitride (GaN)-based power semiconductors from STMicroelectronics are designed to improve efficiency and increase power density in high-demand applications ...
|
May 22, 2026
STMicroelectronics announces enhanced version of industry-proven battery-management IC
STMicroelectronics' L9963F automotive battery-management IC includes all the features needed to manage lithium battery packs in hybrid (HE) and full electric (FE) vehicles, ...
|
May 21, 2026
STMicroelectronics' new gate drivers boost economy, performance, and efficiency
STMicroelectronics has introduced new STDRIVE102 gate-driver ICs for three-phase brushless motors, adding the STDRIVE102P and STDRIVE102BP that feature an SPI ...
|
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Chemically Resistant, UV Curable Epoxy
Master Bond UV26SP is a low outgassing UV curing system with high temperature and chemical resistance for bonding, sealing and coating.
Master Bond
|
|
|
