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Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
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| Press Release |
May 5, 2026 - Click the title to read the full press release.
StratEdge Corporation announced it received a Gold Tier Award from BAE Systems' Partner 2 Win program. The award recognizes StratEdge Corporation's exceptional performance ...
StratEdge Corporation
May 19, 2026
StratEdge Takes High-Reliability Packaging on the Road for CSMantech, Space Tech Expo USA, and IMS 2026
StratEdge Corporation announces that it will exhibit at three upcoming industry events: CSMantech, May 18–20, Portland, OR, Booth 418; Space Tech Expo USA, June 3–4, Anaheim ...
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May 5, 2026
StratEdge Honored with a Partner 2 Win Gold Tier Award from BAE Systems
StratEdge Corporation announced it received a Gold Tier Award from BAE Systems' Partner 2 Win program. The award recognizes StratEdge Corporation's exceptional performance ...
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April 9, 2026
StratEdge Brings Gold Plated Tab and Packaging Expertise to CMSE 2026
StratEdge Corporation announces that it will exhibit at CMSE 2026, taking place April 28-30 in Los Angeles, CA. At Booth B10, StratEdge will highlight its gold plated tab product ...
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March 3, 2026
StratEdge Showcasing Molded Ceramic Packages at IMAPS Device Packaging and GOMACTech
StratEdge Corporation will highlight its molded ceramic and gold plated tab products lines at two March exhibitions. Come see us at the IMAPS Device Packaging Conference ...
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February 17, 2026
VIEWPOINT 2026: Casey Krawiec, VP of Global Sales, StratEdge Corporation
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December 10, 2025
Die-on-Tab for Compound Semiconductors: Enabling Advanced RF Power Systems
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
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November 17, 2025
StratEdge Celebrates IMAPS Awards for President Tim Going and VP Casey Krawiec
StratEdge Corporation is proud to announce that President Tim Going has been awarded the prestigious IMAPS Founders Award, recognizing his technical and leadership ...
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September 30, 2025
StratEdge Highlights High-Performance Packaging at IMAPS and BCICTS
StratEdge Corporation will showcase its thermally efficient line of post-fired and molded ceramic packages at two upcoming events: Booth 719 at the IMAPS International Symposium ...
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August 28, 2025
StratEdge to Display Packaging Innovation at European Microwave Week Exhibition
StratEdge Corporation will showcase its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth A095 at European Microwave Week (EuMW), ...
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June 16, 2025
StratEdge Marks 40 Years of Innovation at IMS 2025 Booth 336
StratEdge Corporation will showcase its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 336 at the International Microwave Symposium ...
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DIE Stacking on a Small Area
Assembly process where chips are stacked on top of one another on a substrate. This vertical integration allows a compact arrangement of different circuits with different dimensions on a small area.
Tresky Automation
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