semiconductor
packaging news
Sponsor
Circuit-Technology-Center

Improve BGA Rework Success with Proven Reballing Techniques
Successful BGA reballing depends on precision, process control, and attention to detail. Circuit Technology Center utlizies proven methods and techniques.
Circuit Technology Center
Uyemura
Press Release
April 17, 2026  -  Click the title to read the full press release.

Aehr Receives Record $41 Million Production Order from Lead Hyperscale AI Customer



Aehr Test Systems announced it has received a record $41 million follow-on production order from its lead hyperscale customer for package-level burn-in (PLBI) of custom AI processor ...

Aehr Test Systems
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
MicroCircuit-Laboratories-LLC

Rapid Package Seam Seal Changeover
The Robotic Cover Sealer (RCS) enables rapid assembly changeover on < 5 minutes from a 3 x 3 mm to 50 x 70 mm package. Package tooling may be adjustable or tool less.
MicroCircuit Laboratories, LLC
Pac-Tech