| Press Release |
April 15, 2026 - Click the title to read the full press release.
Electronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter ...
SEMI
June 25, 2026
SEMICON West 2026 to Spotlight Key Innovations and Market Drivers Powering the Semiconductor Industry Beyond $1 Trillion
SEMI announced this year's SEMICON® West will be held October 13-15 at Moscone Center in San Francisco. Returning to the Bay Area after a successful inaugural event ...
|
June 23, 2026
Strategic Materials Conference 2026 to Spotlight Materials Innovations Fueling the AI Era
The Strategic Materials Conference (SMC) 2026 will convene materials and semiconductor leaders from July 13-15, 2026 at Hayes Mansion in San Jose, Calif. for three days ...
|
June 16, 2026
SEMICON Taiwan 2026 to Serve as Global Stage Where the Semiconductor Industry Defines What's Next
SEMICON Taiwan 2026 will be held September 2-4 at the Nangang Exhibition Center in Taipei, with forums beginning on August 31 to align with International Semiconductor Week. ...
|
June 8, 2026
SEMI Reports Global Semiconductor Equipment Billings Increased 14% Year-Over-Year in Q1 2026
SEMI announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report that global semiconductor equipment billings increased 14% year-over-year ...
|
May 28, 2026
SEMI and Global Net Corp. Release New Report on Glass Core Substrate Market and Development Trends
SEMI announced the availability of a new industry research report focused on the glass core substrate market and trends, produced in collaboration with Global Net Corp. (GNC). ...
|
May 21, 2026
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
FlexTech issued a request for proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive ...
|
May 20, 2026
SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics
FlexTech issued a request for proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive ...
|
May 18, 2026
SEMI and 23 Member Companies Urge U.S. Congress to Extend Advanced Manufacturing Investment Credit
SEMI and 23 member companies on the SEMI Tax Policy Committee, issued a letter to the U.S. Congress urging immediate passage of a multi-year extension of the Advanced ...
|
May 14, 2026
Global Semiconductor Materials Market Revenue Reaches Record $73.2 Billion in 2025, SEMI Reports
Global semiconductor materials market revenue increased 6.8% year-over-year to $73.2 billion in 2025, SEMI, reported today in its Materials Market Data Subscription (MMDS). ...
|
May 12, 2026
SEMI 3D & Systems Summit to Advance Heterogeneous Systems Integration
Global experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden, Germany. ...
|
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Rapid Package Seam Seal Changeover
The Robotic Cover Sealer (RCS) enables rapid assembly changeover on < 5 minutes from a 3 x 3 mm to 50 x 70 mm package. Package tooling may be adjustable or tool less.
MicroCircuit Laboratories, LLC
|
|
|
