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packaging news
Sponsor
Amkor-Technology

Advanced Packaging for Next-Generation Vehicle
As cars move to a central computing architecture, splitting SoCs into chiplets becomes a logical solution to size and cost challenges. Read more.
Amkor Technology, Inc.
Balazs-Nanoanalysis
Press Release
April 13, 2026  -  Click the title to read the full press release.

QT9 Software to Showcase Pre-Validated ERP Platform at MODEX 2026



QT9 Software will showcase its QT9 ERP platform at MODEX 2026, taking place April 13–16, 2026, in Atlanta, GA. At booth A1105, attendees will see how QT9 ERP unites ...

QT9
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Sponsor
Dr.-Tresky-AG

1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG
Akrometrix