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Fine-Pitch MEMS Bonding Precision
Upgrade MEMS cantilever bonding with LAPLACE®-CAN. Laser-assisted accuracy, 30µm pitch, and inline repair for perfect wafer probe cards every time.
PacTech
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| Press Release |
April 14, 2026 - Click the title to read the full press release.
Siemens, in close collaboration with NVIDIA, announced that its Veloce™ proFPGA CS hardware-assisted verification and validation system is empowering designers and system ...
Siemens
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Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
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