| Press Release |
April 9, 2026 - Click the title to read the full press release.
The Measuring Division of Kaman Precision Products, Inc. is pleased to highlight its Advanced Magnetic Sensing (AMS) family of high-precision non-contact displacement ...
Kaman
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1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG
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