| Press Release |
April 2, 2026 - Click the title to read the full press release.
The Adaptsys Group will exhibit at SEMICON Southeast Asia 2026, taking place May 5–7, 2026 at the Malaysia International Trade & Exhibition Centre (MITEC). At Booth 1340 ...
The Adaptsys Group
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| Sponsor |
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1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG
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