semiconductor
packaging news
Sponsor
kyzen

Advanced Packaging and Electronic Assembly Cleaning Fluid Innovation
This paper will present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Read more.
KYZEN
XYZTEC
Press Release
March 24, 2026  -  Click the title to read the full press release.

iMAPS New England 52nd Symposium Call for Abstracts



Our Technical Committee seeks contributions that advance design, assembly, and reliability of microelectronic and microsystem packaging. You should present technical ...

iMAPS
March 24, 2026
iMAPS New England 52nd Symposium Call for Abstracts
Our Technical Committee seeks contributions that advance design, assembly, and reliability of microelectronic and microsystem packaging. You should present technical ...
February 23, 2026
IMAPS Announces Purchase of the 3D InCites Platform
The International Microelectronics Assembly and Packaging Society (IMAPS) is pleased to announce a major milestone for the Society, with IMAPS taking over the "stewardship" ...
February 2, 2026
IMAPS Device Packaging Conference 2026 to Focus on AI, Chiplets, and Advanced Integration
The 22nd Annual Device Packaging Conference , organized by the International Microelectronics Assembly and Packaging Society (IMAPS), will take place March 2–5, 2026 ...
June 5, 2025
IMAPS CHIPcon Planned for July 7-10, 2025 in San Jose, California
The IMAPS CHIPcon conference will be held July 7-10, 2025, at the Marriott in downtown San Jose, California. This event will focus exclusively on the innovative device ...
January 8, 2025
IMAPS Device Packaging and Advanced Packaging for Medical Microelectronics to Co-locate in Phoenix, AZ
The 21th Annual Device Packaging Conference (DPC 2025) will be held March 3-6, 2025, at the Sheraton Grand at Wild Horse Pass in Phoenix, Arizona. This esteemed ...
August 15, 2024
IMAPS 57th Int'l Symposium on Microelectronics Sept. 30 - Oct. 3
The 57th International Symposium on Microelectronics (IMAPS 2024) will be held September 30 - October 3, 2024, at the Encore Boston Harbor in Boston, Massachusetts. ...
June 3, 2024
IMAPS Academy Online Portal Launched to Support Semiconductor Advanced Packaging Workforce Development
The International Microelectronics Assembly and Packaging Society (IMAPS) formally introduced IMAPS Academy, an online training resource to support the industry's ...
April 16, 2024
IMAPS & IPC to Host Onshoring Workshop April 29 – May 1, 2024
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking ...
January 30, 2024
IMAPS Device Packaging Conf. & Workshop on Adv. Packaging for Medical Microelectronics to Co-locate
The 20th Annual Device Packaging Conference (DPC 2024) will be held March 18-21, 2024, at the WeKoPa Resort and Conference Center in Fountain Hills, Arizona. This esteemed ...
August 28, 2023
IMAPS 56th International Symposium on Microelectronics Planned for October 2-5
The 56th International Symposium on Microelectronics (IMAPS 2023) will be held October 2-5, 2023, at the Town & Country Resort in San Diego, California. This jam-packed ...
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Henkel-AG-Co

You can't spell brain without AI
Custom silicon is changing how AI works. But why, and how? Get a first-hand perspective from Vishal Kirti, Senior ASIC Leader at Cisco Systems. A new read on Uniquely Wired.
Henkel AG & Co.
Nordson-ASYMTEK