| Press Release |
March 23, 2026 - Click the title to read the full press release.
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how innovative interconnect materials can drive higher yields and reliability in semiconductor packaging ...
Indium Corporation
March 24, 2026
Indium Corporation to Feature Materials Solutions Powering Sustainability at APEC 2026
As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products at APEC 2026 ...
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March 23, 2026
Indium Corporation to Present Advanced Semiconductor Packaging Solutions at CPCA 2026
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how innovative interconnect materials can drive higher yields and reliability in semiconductor packaging ...
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March 19, 2026
Indium Corporation Presents Cost-Effective Copper Sinter Solutions for Power Electronics at APEC 2026
Indium Corporation® Product Manager – Semiconductor Dean Payne will present copper sinter paste solutions that deliver high thermal and reliability performance, while ...
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March 4, 2026
VIEWPOINT 2026: Ross Berntson, President and CEO, Indium Corporation
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March 2, 2026
Indium Corporation Powers the Future With Advanced Materials Solutions at CIPS 2026
As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products at CIPS – International ...
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February 26, 2026
Indium Corporation to Present on Indium Oxidation and Its Impact on Precision Applications at SEMI-THERM 2026
Indium Corporation® Product Manager, Engineered Solder Materials (ESM), Jim McCoy, will present techniques to minimize oxidation and improve the thermal conductivity ...
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February 23, 2026
Indium Corporation to Feature High-Performance Thermal Management Solutions at TestConX 2026
As one of the leading providers of high-performance thermal management solutions, Indium Corporation® will feature its lineup of metal thermal interface materials (TIMs) ...
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February 18, 2026
Indium Engineer Examines Key Factors Impacting Improvements in Metal TIMs at TestConX 2026
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2026, taking place March 1-4 in Mesa, Arizona. The session, ...
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January 20, 2026
Indium Corporation to Reinforce Its Leadership in Ag and Cu Pressure Sinter Solutions at NEPCON Japan 2026
Indium Corporation® will feature its highly versatile InFORCE® series of pressure sinter paste at NEPCON Japan 2026, January 21-23, in Tokyo. The company will showcase ...
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January 14, 2026
Indium Corporation Brings Precision Au-Based Die-Attach Preforms to SPIE Photonics West
Indium Corporation® will showcase its high-reliability, Au-based precision die-attach preforms for critical laser applications at SPIE Photonics West, January 20-22, in San Francisco ...
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