| Press Release |
March 19, 2026 - Click the title to read the full press release.
Indium Corporation® Product Manager – Semiconductor Dean Payne will present copper sinter paste solutions that deliver high thermal and reliability performance, while ...
Indium Corporation
May 29, 2026
Indium Experts Address Power Electronics and Thermal Management Solutions at PCIM Expo 2026
Indium Corporation® will feature three experts addressing critical industry challenges at PCIM Expo 2026, June 9-11, in Nuremberg, Germany. Improving Thermomechanical Reliability ...
|
May 28, 2026
Indium Corporation Receives ASE Technology Sustainability Award
Indium Corporation® received a Sustainability Award from ASE Technology Holding Co., Ltd. (ASE) at their recent 2025 Best Suppliers Award Ceremony in Taichung, Taiwan. ...
|
May 26, 2026
Indium Corporation to Highlight Power Device Packaging Solutions at ECTC 2026
As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will showcase its high-reliability portfolio of products ...
|
May 19, 2026
Indium to Present on Metal TIMs Solutions for Demanding Thermal Environments at CSPT
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how metal thermal interface materials (TIMs) can unlock the full performance potential of next-generation ...
|
May 18, 2026
Indium Corporation Expert to Present sTIMs Solution for AI Thermal Challenges at IEEE ECTC
Indium Corporation® Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder thermal ...
|
May 14, 2026
Indium Corporation Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical ...
|
May 7, 2026
Indium Corporation to Present High-Performance AI Application Solutions at SEMICON SEA 2026
As a leading provider of advanced materials solutions enabling today's demanding AI applications, Indium Corporation® experts will share their technical insight and knowledge ...
|
May 4, 2026
Indium Corporation to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia. Company products to be highlighted include ...
|
April 29, 2026
Indium Corporation Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain
Indium Corporation announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) ...
|
April 28, 2026
Indium Corporation Joins India's IDSPS Industry Consortium Partnership
Indium Corporation® announced that it has joined the Indian Design, Semiconductor, Packaging and Systems (IDSPS) program, a national initiative supporting R&D, workforce ...
|
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
|
|
|
