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Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
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| Press Release |
March 19, 2026 - Click the title to read the full press release.
Imec announces the arrival of the ASML EXE:5200 High NA EUV lithography system, the most advanced lithography tool available today. With this strategic milestone, imec ...
Imec
May 19, 2026
Imec expands the global footprint of imec.ventures with a dedicated US presence
Imec unveiled a dedicated imec.ventures presence in the United States, with teams in Silicon Valley and on the East Coast. This step supports imec's ambition to drive the ...
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May 13, 2026
IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
Imec announced that IC-Link by imec, imec's design and manufacturing service provider for ASIC and silicon photonics, has joined TSMC Open Innovation Platform® (OIP) ...
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March 19, 2026
Imec receives the world's most advanced High NA EUV
Imec announces the arrival of the ASML EXE:5200 High NA EUV lithography system, the most advanced lithography tool available today. With this strategic milestone, imec ...
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March 9, 2026
Next Generation, Permanent DNA-based data storage for the AI Age
imec and Atlas Data Storage announce a new strategic partnership to accelerate the development of digital data storage using synthetic DNA. The collaboration combines ...
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March 2, 2026
Imec unlocks lever for EUV dose reduction
At the 2026 SPIE Advanced Lithography + Patterning Conference, imec demonstrates that precise control of gas compositions during post-exposure EUV lithography ...
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February 18, 2026
Imec unveils 7 bit, 175GS/s massively time-interleaved slope-ADC
At IEEE ISSCC 2026, imec unveiled a 7 bit, 175GS/s analog to digital converter (ADC) that combines a record-small footprint (250 x 250µm²) and low conversion energy ...
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December 11, 2025
Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures
At the 2025 IEEE International Electron Devices Meeting (IEDM), imec presents the first thermal system-technology co-optimization (STCO) study of 3D HBM-on-GPU ...
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December 3, 2025
imec and Brewer Science to Co-Present Breakthroughs at EPTC
Brewer Science, Inc. will co present two technical papers with imec at the IEEE Electronics Packaging Technology Conference (EPTC) in Singapore, December 2–5, 2025. ...
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November 19, 2025
Imec Unveils imec.kelis: A Breakthrough Tool for AI Datacenter Design and Optimization
This week at Super Computing 2025, the premier international conference and exhibition for high performance computing (HPC), imec announced the launch of imec.kelis ...
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October 28, 2025
Imec Sets Electro-Optic Performance Record in Thin-Film Strontium Titanate at Cryogenic Temperatures
At 4 degrees Kelvin, most electro-optic materials falter. Nanoelectronics R&D center imec has now successfully engineered thin-film strontium titanate (SrTiO₃) that delivers ...
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DIE Stacking on a Small Area
Assembly process where chips are stacked on top of one another on a substrate. This vertical integration allows a compact arrangement of different circuits with different dimensions on a small area.
Tresky Automation
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