semiconductor
packaging news
Sponsor
Advanced-Component-Labs

"Build Up" I/C Packages -- USA Fabrication
High layer counts. Low CTE material sets. 20µm Dielectrics /12µm Traces - ITAR Approved - 50um "Stay Flat" Cores. Learn more.
Advanced Component Labs, Inc.
CyberOptics
Press Release
March 17, 2026  -  Click the title to read the full press release.

Nordson Electronics to demonstrate automated fluid dispensing & plasma treatment systems at SEMICON China 2026



Nordson Electronics Solutions will demonstrate their latest equipment for semiconductor manufacturing at SEMICON China 2026, booth 3601 (Hall N2), in the Shanghai New ...

Nordson Electronics Solutions
March 20, 2026
Nordson Electronics Solutions Announces Expanded Distributor Partnership with Assembly Products, Inc.
Nordson Electronics Solutions announced an expanded distribution partnership with Assembly Products, Inc., a subsidiary of Blackstone Global, Inc., extending sales and support ...
March 17, 2026
Nordson Electronics to demonstrate automated fluid dispensing & plasma treatment systems at SEMICON China 2026
Nordson Electronics Solutions will demonstrate their latest equipment for semiconductor manufacturing at SEMICON China 2026, booth 3601 (Hall N2), in the Shanghai New ...
September 29, 2025
Nordson Electronics Solutions enables seamless integration of actnano PFAS-free coatings with ASYMTEK Select Coat®
Nordson Electronics Solutions announces full compatibility of its industry-leading ASYMTEK conformal coating systems with actnano's next-generation, PFAS-free materials. ...
August 20, 2025
Nordson Electronics Solutions to exhibit high-yield fluid dispensing technologies at SEMICON Taiwan 2025
Nordson Electronics Solutions will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326. On display ...
June 12, 2025
Nordson Electronics Solutions develops panel-level packaging solution for Powertech Technology, Inc.
Nordson Electronics Solutions has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson's ...
February 10, 2025
Jabil Recognizes Nordson Electronics Solutions with the 2024 Best Strategic Supplier Award
Nordson Electronics Solutions has been honored with the 2024 Jabil Best Strategic Supplier Award, underscoring Nordson's essential role in enabling Jabil, a global leader ...
October 1, 2024
Nordson Electronics Solutions manufacturing facilities maintain ISO 9001:2015
Nordson Electronics Solutions announces that it has received ISO 9001:2015 Quality Management System certification renewal for its Carlsbad, California, USA facility, effective ...
September 4, 2024
Nordson Electronics Solutions to feature high-throughput fluid dispensing technologies at SEMICON Taiwan
Nordson Electronics Solutions will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516. ...
August 1, 2024
Nordson Electronics Solutions completes its Europe location move to a new, state-of-the-art facility
Nordson Electronics Solutions announces that their Nordson B.V. division, which covers Europe, the Middle East, and Africa, has consolidated its offices into one site in Valkenswaard ...
June 21, 2024
Case Study: Improving Yield for Chip-on-Wafer Underfill
Leading IC manufacturing and technology services provider increases chip-on-wafer (CoW) yield by 3.3% from 96.47% to 99.66%. Download now.
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Brewer-Science

Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
Ontos-Equipment-Systems