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Master-Bond

Two Component, Thermally Conductive Epoxy
Master Bond EP21AOLV-1 is a thermally conductive, electrically isolating adhesive featuring a low CTE, excellent dimensional stability, and high compressive strength.
Master Bond
SEMI
Press Release
March 11, 2026  -  Click the title to read the full press release.

Research and Innovation Factory for AI & Microelectronics



The Federal Ministry of Research, Technology, and Space (BMFTR) has approved €15 million in funding for the AI-DISCO project – Edge/Cloud AI for Distributed Sensing ...

Fraunhofer IPMS
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Sponsor
XYZTEC

Automatic Grading Without Assistance
Eliminate the need for operators to assess bond testing failure modes at the end of an automation run. Auto grading uses machine vision software to process the test result images.
xyztec
Uyemura