semiconductor
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Sponsor
Plasmatreat-GmbH

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semiconductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
Surfx-Technologies
Press Release
March 11, 2026  -  Click the title to read the full press release.

IBM and Lam Research Announce Collaboration to Advance Sub-1nm Logic Scaling



IBM and Lam Research Corp. announced a collaboration aimed at developing new processes and materials to support sub-1nm logic scaling. Building on a long record of successful ...

IBM
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Sponsor
Brewer-Science

Ultra-Thin Wafer Handling
Brewer Science temporary wafer bonding systems allow for safe handling and transport of ultrathin wafers during rigorous backside processing steps.
Brewer Science
Tresky