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2026 IEEE ECTC – May 26-29 in Orlando
The Electronic Components & Technology Conference delivers the best in packaging, components & microelectronic technologies, held at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL.
ECTC
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| Press Release |
March 2, 2026 - Click the title to read the full press release.
As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products at CIPS – International ...
Indium Corporation
May 15, 2026
Indium Corporation Expert to Present sTIMs Solution for AI Thermal Challenges at IEEE ECTC
Indium Corporation® Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder thermal ...
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May 14, 2026
Indium Corporation Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
As a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical ...
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May 7, 2026
Indium Corporation to Present High-Performance AI Application Solutions at SEMICON SEA 2026
As a leading provider of advanced materials solutions enabling today's demanding AI applications, Indium Corporation® experts will share their technical insight and knowledge ...
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May 4, 2026
Indium Corporation to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia. Company products to be highlighted include ...
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April 29, 2026
Indium Corporation Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain
Indium Corporation announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) ...
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April 28, 2026
Indium Corporation Joins India's IDSPS Industry Consortium Partnership
Indium Corporation® announced that it has joined the Indian Design, Semiconductor, Packaging and Systems (IDSPS) program, a national initiative supporting R&D, workforce ...
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April 7, 2026
Double Win: Indium Corporation's CW-807RS and Indium12.9HF Receive EM Asia Innovation Honors
Indium Corporation® recently received Electronics Manufacturing (EM) Asia Innovation Awards for its halogen-free CW-807RS flux-cored wire and Indium12.9HF solder ...
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April 6, 2026
Indium Corporation Announces Strategic Agreement for Domestic Critical Metals Recovery
Indium Corporation® announced that it has executed a long-term offtake framework agreement with Flash Metals USA Inc., a wholly owned subsidiary of Metallium Limited ...
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March 24, 2026
Indium Corporation to Feature Materials Solutions Powering Sustainability at APEC 2026
As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products at APEC 2026 ...
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March 23, 2026
Indium Corporation to Present Advanced Semiconductor Packaging Solutions at CPCA 2026
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how innovative interconnect materials can drive higher yields and reliability in semiconductor packaging ...
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Seam Seal Data Collection
Robotic Cover Sealer (RCS) is a fully digital, automated seam seal process using AI. Complete data is provided on each package and lid.
MicroCircuit Laboratories LLC
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