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Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology
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| Press Release |
February 23, 2026 - Click the title to read the full press release.
Asahi Kasei Microdevices Corporation (AKM) has announced that its commercialization of thin-film Hall elements, initiated in 1983, has been recognized as an IEEE Milestone ...
Asahi Kasei Microdevices Corporation
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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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