semiconductor
packaging news
Sponsor
AI-Technology-Inc

AEC Grade-0 and MSL Level-1 Conductive Paste & Film Adhesives
240° Tg and ultra-high thermal stability for AEC Grade-0 applications. Proven rapid and snap curing die-attach paste for ultimate productivity.
AI Technology, Inc.
Master-Bond
Press Release
February 19, 2026  -  Click the title to read the full press release.

Plasmatreat USA Highlights Advanced Plasma Nozzle and HydroPlasma® Cleaning Technologies at IMAPS



Plasmatreat USA, Inc. will showcase advanced solutions for particle-free, contactless, chemical-free, and inline-compatible surface pretreatment for semiconductor ...

Plasmatreat
May 22, 2026
PCIM: Plasma for High-Quality Power Modules
How can power modules be manufactured to reliably function under increasing power densities, higher temperatures, and new material combinations? This question ...
February 19, 2026
Plasmatreat USA Highlights Advanced Plasma Nozzle and HydroPlasma® Cleaning Technologies at IMAPS
Plasmatreat USA, Inc. will showcase advanced solutions for particle-free, contactless, chemical-free, and inline-compatible surface pretreatment for semiconductor ...
November 5, 2025
Next-Level Electronics Manufacturing with Plasma Technology
Plasmatreat GmbH will showcase state-of-the-art solutions for particle-free, contactless, chemical-free, and inline-compatible surface pretreatment in semiconductor and ...
April 24, 2025
Openair-Plasma® technology for high-performance and long-lasting batteries - efficient, sustainable, reliable
Plasmatreat is presenting its innovative surface treatment solutions at the Battery Show Europe 2025 in Stuttgart, Germany, in hall 8, booth C10. With Openair-Plasma® ...
April 9, 2025
Plasmatreat presents live processes for oxide layer reduction and improved adhesion at PCIM
Power modules are at the heart of many modern power electronics applications, from e-mobility and renewable energy to industrial automation and medical technology. Their ...
February 24, 2025
VIEWPOINT 2025: Lukas Buske, CEO, Plasmatreat GmbH
February 10, 2025
Innovative Technologies for Plasma Surface Treatment in Korea
Plasmatreat Korea is pleased to announce its participation at SEMICON Korea 2025. From February 19 to 21, 2025, visitors will have the opportunity to learn more about ...
December 5, 2024
Plasma as a Key Technology: Increasing Efficiency and Quality Assurance in the Electronics Industry
Plasma technology improves electronics manufacturing, reduces oxide layers without the use of flux, prevents delamination, improves adhesion and enables environmentally friendly, high performance products by using Openair-Plasma® and PlasmaPlus®.
December 2, 2024
Opening Subsidiary in Mexico
On-site sales, consulting, application engineering and service for local companies and global corporations based in Mexico: Plasmatreat GmbH has opened another ...
November 4, 2024
Game-Changing Solutions for Power Module and Semiconductor Production with Plasma Technology
Plasmatreat GmbH is excited to announce its first participation at the electronica and SEMICON Europa in hall C5 at booth 169. The trade fairs which take place from November ...
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Amkor-Technology

Amkor's Double Sided Molded BGA Solutions
To improve the integration of RFFE solutions, Amkor offers a DSMBGA package that allows molded assembly of components on both sides of the substrate.
Amkor Technology, Inc.
Brewer-Science