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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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| Press Release |
February 17, 2026 - Click the title to read the full press release.
Fraunhofer Institute for Photonic Microsystems IPMS has achieved another breakthrough in pH measurement technology. Researchers have developed a new technology ...
Fraunhofer Institute for Photonic Microsystems (IPMS)
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Current Characterization of Various Cu RDL Designs In WLP
This study evaluates copper redistribution layer fusing currents in WLP through experiments and simulations, finding that silicon thickness significantly improves heat dissipation and fusing performance.
Amkor Technology
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