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Sponsor
Amkor-Technology

Advanced Packaging for Next-Generation Vehicle
As cars move to a central computing architecture, splitting SoCs into chiplets becomes a logical solution to size and cost challenges. Read more.
Amkor Technology, Inc.
Balazs-Nanoanalysis
Press Release
February 5, 2026  -  Click the title to read the full press release.

STMicroelectronics' space-grade driver supports high-speed data and low-voltage logic



Supporting faster data speeds in space applications, ST's RHFLVDS41 Low-Voltage Differential Signaling driver sets a new performance benchmark among QML-V ...

STMicroelectronics
May 1, 2026
STMicroelectronics' wide-bandwidth 3-axis vibration sensor saves space, energy, and bill of materials
Combining sensing for three axes in a single digital device, STMicroelectronics’ IIS3DWBG1 wide-bandwidth vibration sensor simplifies design and cuts bill-of-materials costs ...
April 28, 2026
STMicroelectronics brings always-on vision to next-generation personal electronics
STMicroelectronics introduces a new generation of ultralow-power global-shutter image sensors that deliver high-quality, always-on vision to compact devices operating on batteries ...
April 21, 2026
STMicroelectronics reveals high-precision op amps for 4V-36V range
STMicroelectronics' TSB192 dual op amps deliver very high precision for applications that need a wide operating-voltage range, with offset voltage of 20µV, temperature drift ...
April 6, 2026
STMicroelectronics' fast-switching GaN drivers add smart protection for motion control and power conversion
STMicroelectronics has announced two new high-speed half-bridge gate drivers that bring gallium-nitride (GaN) efficiency, thermal performance, and miniaturization to a broad ...
April 1, 2026
STMicroelectronics' low-resistance MOSFETs save energy and PCB area
STMicroelectronics has introduced a series of low-RDS(on) MOSFETs made with new Smart STripFET F8 technology, which is engineered for optimum conduction performance ...
March 31, 2026
Power management optimized ICs for STM32 microprocessors in industrial applications
STMicroelectronics' STPMIC1L and STPMIC2L power-management ICs (PMICs) help designers leverage the embedded-processing muscle of ST's Arm® Cortex®-A microprocessors ...
March 23, 2026
STMicroelectronics' GaN reference design targets motor-control applications
STMicroelectronics' EVSTDRVG611MC gallium-nitride (GaN) motor-control reference design for appliances and industrial drives handles more than 600W without a heatsink, ...
March 18, 2026
STMicroelectronics' single-chip buck converter packs 3A power for appliances, industrial loads
Capable of supplying 3A from a 3mm x 1.6mm footprint, STMicroelectronics' DCP3603 monolithic buck converter simplifies design, saves PCB space, accelerates time to market ...
March 17, 2026
STMicroelectronics and Leopard Imaging accelerate robotics vision with NVIDIA Jetson-ready multi-sensor module
STMicroelectronics and Leopard Imaging® have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining ST imaging, ...
March 11, 2026
STMicroelectronics accelerates AI-enhanced motor control with machine-learning software pack
STMicroelectronics has released motor-control software to simplify enhancing drives with AI for optimization and predictive maintenance, ready to load on the EVLSPIN32G4-ACT ...
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Sponsor
Dr.-Tresky-AG

1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG
Akrometrix