| Press Release |
February 5, 2026 - Click the title to read the full press release.
Supporting faster data speeds in space applications, ST's RHFLVDS41 Low-Voltage Differential Signaling driver sets a new performance benchmark among QML-V ...
STMicroelectronics
May 1, 2026
STMicroelectronics' wide-bandwidth 3-axis vibration sensor saves space, energy, and bill of materials
Combining sensing for three axes in a single digital device, STMicroelectronics’ IIS3DWBG1 wide-bandwidth vibration sensor simplifies design and cuts bill-of-materials costs ...
|
April 28, 2026
STMicroelectronics brings always-on vision to next-generation personal electronics
STMicroelectronics introduces a new generation of ultralow-power global-shutter image sensors that deliver high-quality, always-on vision to compact devices operating on batteries ...
|
April 21, 2026
STMicroelectronics reveals high-precision op amps for 4V-36V range
STMicroelectronics' TSB192 dual op amps deliver very high precision for applications that need a wide operating-voltage range, with offset voltage of 20µV, temperature drift ...
|
April 6, 2026
STMicroelectronics' fast-switching GaN drivers add smart protection for motion control and power conversion
STMicroelectronics has announced two new high-speed half-bridge gate drivers that bring gallium-nitride (GaN) efficiency, thermal performance, and miniaturization to a broad ...
|
April 1, 2026
STMicroelectronics' low-resistance MOSFETs save energy and PCB area
STMicroelectronics has introduced a series of low-RDS(on) MOSFETs made with new Smart STripFET F8 technology, which is engineered for optimum conduction performance ...
|
March 31, 2026
Power management optimized ICs for STM32 microprocessors in industrial applications
STMicroelectronics' STPMIC1L and STPMIC2L power-management ICs (PMICs) help designers leverage the embedded-processing muscle of ST's Arm® Cortex®-A microprocessors ...
|
March 23, 2026
STMicroelectronics' GaN reference design targets motor-control applications
STMicroelectronics' EVSTDRVG611MC gallium-nitride (GaN) motor-control reference design for appliances and industrial drives handles more than 600W without a heatsink, ...
|
March 18, 2026
STMicroelectronics' single-chip buck converter packs 3A power for appliances, industrial loads
Capable of supplying 3A from a 3mm x 1.6mm footprint, STMicroelectronics' DCP3603 monolithic buck converter simplifies design, saves PCB space, accelerates time to market ...
|
March 17, 2026
STMicroelectronics and Leopard Imaging accelerate robotics vision with NVIDIA Jetson-ready multi-sensor module
STMicroelectronics and Leopard Imaging® have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining ST imaging, ...
|
March 11, 2026
STMicroelectronics accelerates AI-enhanced motor control with machine-learning software pack
STMicroelectronics has released motor-control software to simplify enhancing drives with AI for optimization and predictive maintenance, ready to load on the EVLSPIN32G4-ACT ...
|
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG
|
|
|