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Sponsor
DL-Technology

Die Bonding Made Easy
The DL Technology X-Form needles are custom manufactured for conductive epoxy dispensing in die bonding applications. Each needle is machined using DL's patented EZ-FLO.
DL Technology
Ormet-TLPS
Press Release
January 23, 2026  -  Click the title to read the full press release.

CEA-Leti Demonstrates Combined MicroLED and Organic Photodetector Architecture



CEA-Leti demonstrated a co-packaged microLED and organic photodetector (OPD) architecture that enables optical sensing functions. This solution paves the way to integrate ...

CEA-Leti
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Sponsor
Akrometrix

Effect of Package Warpage and Composite CT on Failure Modes
Researchers analyze board-level reliability of surface mount devices in thermal cycling, identifying failure modes via warpage and strain data.
Akrometrix
Surfx-Technologies