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Circuit-Technology-Center

Tech Paper - The Essential Guide for High-Reliability BGA Component Re-balling
This paper outlines best practices and challenges in reballing Ball Grid Array (BGA) components. Download this free tech paper.
Circuit Technology Center
EV-Group
Press Release
January 16, 2026  -  Click the title to read the full press release.

Mobile Dust Collectors Introduced for Short-term Rental, Testing



Tri-Mer Corporation has introduced a flexible, cost-effective rental program for short-term production and research. Skid-mounted dust collectors are easy to set-up ...

Tri-Mer Corporation
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Surfx-Technologies

Particle-Free Plasma Oxide Reduction
Ar/H2 plasma for flux-free flip chip bonding. Low temp, uniform 100 mm wide beams. Fast oxide removal. No damage or particles. Contact us for integration into your TCB bonder.
Surfx Technologies
Plasma-Etch