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MRSI

Elevate Efficiency: MRSI-H1 Die Bonder
Transform your assembly with precision and speed. Discover unparalleled quality and efficiency.
MRSI
Plasma-Etch
Press Release
January 19, 2026  -  Click the title to read the full press release.

Electrically Insulating Epoxy Features Ultra-High Thermal Conductivity



Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring ...

Master Bond
February 19, 2026
Dual Cure Medical Adhesive Features High Tg and Autoclave Resistance
Master Bond UV26DCMed is a one component, dual cure adhesive system designed for medical device assembly. It is specifically engineered for reusable devices that ...
January 19, 2026
Electrically Insulating Epoxy Features Ultra-High Thermal Conductivity
Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring ...
January 5, 2026
Structural One Part Epoxy for High-Performance Bonding Applications
Master Bond Supreme 10HTLV is a one part, non-frozen, heat cured epoxy formulated for demanding structural bonding applications. This toughened system features a moderately ...
November 24, 2025
One Part 300°C Rated Silicone Passes Non-Cytotoxicity Standards
MasterSil 800Med is a one component, moisture curing silicone specifically designed for medical device manufacturing. It passes ISO 10993-5 testing for non-cytotoxicity, confirming ...
September 24, 2025
Nanosilica Filled, Dual Curable Adhesive Offers Rapid Fixturing with LED Light
Master Bond LED422DC90 is a one component, nanosilica filled dual cure adhesive system engineered for high-speed fixturing and bonding of opaque substrates. This ...
May 22, 2025
One Part Silver Filled Electrically Conductive Epoxy Passes ISO 10993-5 Standard
Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room ...
April 29, 2025
Toughened, UV Curable Adhesive Features Optical Clarity
Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, UV curable adhesive system. Optimal adhesion is achieved in bond line thicknesses of 0.001-0.003 inch, ...
March 25, 2025
Non-Drip Cryogenic Epoxy Offers Electrical and Thermal Insulation
Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically ...
February 26, 2025
Medical Grade, Dual Curable Adhesive Offers Rapid Fixturing with LED Light
Master Bond LED415DC90Med is a one component, dual cure adhesive system designed for high-speed manufacturing of medical electronic devices. It cures rapidly without ...
January 21, 2025
Thermally Conductive, Flowable Epoxy Meets NASA Low Outgassing Specifications
Master Bond has launched EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. ...
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AI-Technology-Inc

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
Uyemura