| Press Release |
January 14, 2026 - Click the title to read the full press release.
Indium Corporation® will showcase its high-reliability, Au-based precision die-attach preforms for critical laser applications at SPIE Photonics West, January 20-22, in San Francisco ...
Indium Corporation
April 29, 2026
Indium Corporation Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain
Indium Corporation announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) ...
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April 28, 2026
Indium Corporation Joins India's IDSPS Industry Consortium Partnership
Indium Corporation® announced that it has joined the Indian Design, Semiconductor, Packaging and Systems (IDSPS) program, a national initiative supporting R&D, workforce ...
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April 7, 2026
Double Win: Indium Corporation's CW-807RS and Indium12.9HF Receive EM Asia Innovation Honors
Indium Corporation® recently received Electronics Manufacturing (EM) Asia Innovation Awards for its halogen-free CW-807RS flux-cored wire and Indium12.9HF solder ...
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April 6, 2026
Indium Corporation Announces Strategic Agreement for Domestic Critical Metals Recovery
Indium Corporation® announced that it has executed a long-term offtake framework agreement with Flash Metals USA Inc., a wholly owned subsidiary of Metallium Limited ...
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March 24, 2026
Indium Corporation to Feature Materials Solutions Powering Sustainability at APEC 2026
As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products at APEC 2026 ...
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March 23, 2026
Indium Corporation to Present Advanced Semiconductor Packaging Solutions at CPCA 2026
Indium Corporation® Senior Area Technical Manager Leo Hu will discuss how innovative interconnect materials can drive higher yields and reliability in semiconductor packaging ...
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March 19, 2026
Indium Corporation Presents Cost-Effective Copper Sinter Solutions for Power Electronics at APEC 2026
Indium Corporation® Product Manager – Semiconductor Dean Payne will present copper sinter paste solutions that deliver high thermal and reliability performance, while ...
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March 4, 2026
VIEWPOINT 2026: Ross Berntson, President and CEO, Indium Corporation
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March 2, 2026
Indium Corporation Powers the Future With Advanced Materials Solutions at CIPS 2026
As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products at CIPS – International ...
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February 26, 2026
Indium Corporation to Present on Indium Oxidation and Its Impact on Precision Applications at SEMI-THERM 2026
Indium Corporation® Product Manager, Engineered Solder Materials (ESM), Jim McCoy, will present techniques to minimize oxidation and improve the thermal conductivity ...
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