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1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG
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| Press Release |
January 12, 2026 - Click the title to read the full press release.
Aehr Test Systems announced that during its fiscal third quarter to date it has received orders from multiple customers totaling more than $5.5 million for its Sonoma™ ...
Aehr Test Systems
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Nordson Sight™
Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields.
Nordson Test & inspection
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