| Sponsor |
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Ultra-Thin Wafer Handling
Achieve ≤ 10 µm device thinning with Brewer Science’s BrewerBOND® VersaLayer system: a thermoplastic layer coats device features, while a low-stress adhesive bonds them.
Brewer Science
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| Press Release |
January 13, 2026 - Click the title to read the full press release.
The assembly of optoelectronic components requires maximum precision and permanently stable connections. With NanoHybrid, nanosystec offers a modular platform ...
nanosystec
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