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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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| Press Release |
January 13, 2026 - Click the title to read the full press release.
High-temperature thermal processing is a fundamental requirement in semiconductor manufacturing, supporting critical wafer-level steps such as diffusion, oxidation ...
M-Kube Enterprise LLC
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Thermally Conductive, Low Outgassing Epoxy
Master Bond EP4UF-80 is a thermally conductive, electrically insulating adhesive that offers high mechanical strength and is used for underfill applications.
Master Bond
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