| Sponsor |
|
Nordson Sight™
Nordson Sight™ delivers scalable SPC with traceability, rapid setup, intuitive interface, and powerful analysis tools for improved manufacturing yields.
Nordson Test & inspection
|
|
| Press Release |
January 12, 2026 - Click the title to read the full press release.
SEMI will hold its annual Industry Strategy Symposium (ISS) on Sunday, January 11 through Wednesday, January 14 at the Ritz-Carlton Hotel in Half Moon Bay, Calif. ISS ...
SEMI
April 24, 2026
SEMI's ASMC Event Spotlights Practical Strategies for Overcoming Today's Biggest Challenges
SEMI announced the program for its 37th annual Advanced Semiconductor Manufacturing Conference (ASMC), taking place from May 11-14 in Albany, New York. The premier ...
|
April 22, 2026
SEMICON Southeast Asia 2026 to Convene Leaders in Malaysia
SEMICON Southeast Asia 2026, the region's premier platform for the global semiconductor and electronics manufacturing supply chain, will return to the Malaysia International ...
|
April 15, 2026
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
Electronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter ...
|
April 10, 2026
SEMI Reports Global Semiconductor Equipment Billings Reached $135 Billion in 2025, Up 15% Year-on-Year
Worldwide sales of semiconductor manufacturing equipment increased 15% to $135.1 billion in 2025 from $117.1 billion in 2024, driven by continued investment in advanced ...
|
April 7, 2026
SEMI Projects Double-Digit Growth in Global 300mm Fab Equipment Spending for 2026 and 2027
Worldwide 300mm fab equipment spending is expected to increase 18% to $133 billion in 2026 and 14% to $151 billion in 2027, SEMI reported today in its latest 300mm Fab ...
|
March 10, 2026
MEMS & Sensors Executive Congress 2026 to Explore MEMS and Sensors at the Edge of Perception
Industry leaders across the global MEMS and sensors ecosystem will convene March 31–April 2 at the MEMS & Sensors Executive Congress (MSEC 2026) at the Hyatt Regency ...
|
February 25, 2026
VIEWPOINT 2026: Melissa Grupen-Shemansky, CTO and VP of Technology Coalitions, SEMI
|
February 16, 2026
SEMI Reports 2025 Annual Worldwide Silicon Wafer Shipments and Revenue Results
Worldwide silicon wafer shipments in 2025 increased 5.8% to 12,973 million square inches (MSI) while wafer revenue slipped 1.2% to $11.4 billion over the same ...
|
February 2, 2026
SEMI Outlines 2026 U.S. Policy Priorities to Support Semiconductor Growth, Innovation, and Supply Chain Stability
SEMI announced its 2026 U.S. Policy Strategy: Securing the Semiconductor Supply Chain to Enable American AI Leadership designed to strengthen U.S. competitiveness ...
|
January 27, 2026
FLEX Technology Summit 2026 Spotlights Augmenting Flexible Hybrid Electronics
The FLEX Technology Summit will be held on February 24-26, 2026, at the Wigwam Arizona Resort in Phoenix, Arizona, celebrating 25 years of innovation in flexible hybrid ...
|
|
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Die-to-Wafer Bonding Simplified
Researchers developed a plasma Die-to-Wafer bonding process, eliminating complex carrier wafers & costly vacuum systems, enhancing 3DIC & integrated photonics applications.
Ontos Equipment Systems
|
|
|
