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EV-Group

IR Layer Release Technology for 3D Packaging and Logic Scaling
Ultra-thin layer transfer from silicon carriers with nanometer precision using an IR laser and inorganic release layers revolutionizes 3D packaging & logic scaling.
EV Group
Surfx-Technologies
Press Release
December 23, 2025  -  Click the title to read the full press release.

Kaman Measuring Highlights KD-2306 Non-Contact Displacement Sensing System



The Measuring Division of Kaman Precision Products, Inc. highlights its KD-2306 single-channel, multi-purpose non-contact displacement sensing system. When paired with ...

Kaman
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XYZTEC

Chiplets and Advanced Packaging
Chiplets represent a transformative approach to semiconductor design. This paper underscores the critical relationship between chiplets and material testing. Download now.
XYZTEC
Ormet-TLPS