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Plasma Processing Wafers and Dies
The STW-10 automated plasma system optimizes front-end semiconductor processing, activating silicon surfaces for hybrid bonding. It handles 300 mm wafers or dies on tape frames.
Surfx Technologies
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| Press Release |
December 19, 2025 - Click the title to read the full press release.
TOPPAN Inc. has constructed a new manufacturing line at its Niigata Plant for Flip Chip-Ball Grid Array (FC-BGA) substrates, a form of high-density semiconductor packaging. ...
TOPPAN
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Contamination Control
Balazs™ provides technical expertise in identifying and controlling Airborne Molecular Contamination (AMC) and Surface Molecular Contamination (SMC) for improving process and product yields.
Balazs Nanoanalysis
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