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Amkor-Technology

Advanced Packaging for Next-Generation Vehicle
As cars move to a central computing architecture, splitting SoCs into chiplets becomes a logical solution to size and cost challenges. Read more.
Amkor Technology, Inc.
Balazs-Nanoanalysis
Press Release
December 17, 2025  -  Click the title to read the full press release.

ELSPES Inc. Achieves Breakthrough 3,500 nF/mm² Cap. Density in Silicon DTC



ELSPES Inc. has announced a major advancement in its deep trench capacitor (DTC) roadmap with the development of a next-generation silicon capacitor achieving a capacitance ...

ELSPES Inc.
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Sponsor
Dr.-Tresky-AG

1 of 10 Applications: Flip-Chip
Flip chip bonding at an accuracy of 5 µm or better is simple with Swiss made Tresky die bonders, at temperatures of up to 400°C, both in manual and in semiautomatic mode.
Dr. Tresky AG
Akrometrix