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Surfx-Technologies

In situ hydrogen plasmas — A New Paradigm for Advanced Packaging
Hydrogen plasmas drive breakthroughs in 3D chip technology, enabling ultra-dense interconnects and faster signal speeds above 5 GHz.
Surfx Technologies
Amkor-Technology
Press Release
December 17, 2025  -  Click the title to read the full press release.

TOPPAN to Install Pilot Line for Advanced Semiconductor Packaging at Ishikawa Plant



TOPPAN Inc. will install a pilot line to conduct research and development of advanced semiconductor packaging at the Ishikawa Plant acquired in 2023, aiming to commission ...

TOPPAN Inc.
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Sponsor
SEIKA-America

SAWA SC-BM500E Automatic Stencil Cleaner
Ultrasonic combined with spray cleaning provides an excellent solution for all kinds of applications including wafer bump and electroform stencils.
Seika
kyzen