semiconductor
packaging news
Sponsor
MicroCircuit-Laboratories-LLC

Hermetic Package Seam Seal with HDHS® Technology
Brings a new level of precision and automation for hi-rel microelectronic package encapsulation, increasing seal yields to 99.99% and lowering operation costs for Aerospace, Military, Microwave, Photonics and MEMS.
MicroCircuit Laboratories, LLC
AI-Technology-Inc
Press Release
December 16, 2025  -  Click the title to read the full press release.

STMicroelectronics' precision op amp brings accuracy, speed, and stability



STMicroelectronics' TSZ901 operational amplifier (op-amp) combines precision and zero-drift properties with 10MHz gain-bandwidth (GBW), adding enhanced stability to ...

STMicroelectronics
March 20, 2026
STMicroelectronics' GaN reference design targets motor-control applications
STMicroelectronics' EVSTDRVG611MC gallium-nitride (GaN) motor-control reference design for appliances and industrial drives handles more than 600W without a heatsink, ...
March 18, 2026
STMicroelectronics' single-chip buck converter packs 3A power for appliances, industrial loads
Capable of supplying 3A from a 3mm x 1.6mm footprint, STMicroelectronics' DCP3603 monolithic buck converter simplifies design, saves PCB space, accelerates time to market ...
March 17, 2026
STMicroelectronics and Leopard Imaging accelerate robotics vision with NVIDIA Jetson-ready multi-sensor module
STMicroelectronics and Leopard Imaging® have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining ST imaging, ...
March 11, 2026
STMicroelectronics accelerates AI-enhanced motor control with machine-learning software pack
STMicroelectronics has released motor-control software to simplify enhancing drives with AI for optimization and predictive maintenance, ready to load on the EVLSPIN32G4-ACT ...
March 10, 2026
STMicroelectronics enters high-volume production of its silicon photonics platform
STMicroelectronics is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for ...
March 4, 2026
STMicroelectronics' sensor and secure wireless technologies support Snapdragon Wear Elite
STMicroelectronics now supports leading-edge motion-sensing and secure wireless technologies on Qualcomm Technologies' newly launched personal AI platform, Snapdragon ...
March 3, 2026
STMicroelectronics powers up next-gen digital access control
STMicroelectronics has revealed its contribution to accelerating widespread availability of secure, interoperable access-control technology to unlock doors and openings ...
February 27, 2026
STMicroelectronics' tiny motion sensor boosts comfort and precision in wearable and implantable medical applications
STMicroelectronics' MIS2DU12 MEMS accelerometer combines ultra-low power, signal processing, and an ultra-low profile suitable for wearable and implantable medical ...
February 26, 2026
STMicroelectronics reveals 75V STSPIN motor-drive ICs for scalable industrial drives
STMicroelectronics' STSPIN9P series of 75V motor-drive ICs accelerates development of robust industrial drives. Suited to operation from popular bus voltages such as 48V ...
February 25, 2026
STMicroelectronics' new MasterGaN power ICs combine flexibility with advanced GaN technology
STMicroelectronics has introduced MasterGaN6, beginning the second generation of the MasterGaN half-bridge family. The new power system in package couples an updated ...
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
StratEdge-Corporation

Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
CyberOptics