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Sintering Bonding Process
During the sintering process, the chip is bonded very well to the substrate by means of silver paste. The silver particles are connected to one another by diffusion processes.
Tresky Automation
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| Press Release |
December 16, 2025 - Click the title to read the full press release.
STMicroelectronics' TSZ901 operational amplifier (op-amp) combines precision and zero-drift properties with 10MHz gain-bandwidth (GBW), adding enhanced stability to ...
STMicroelectronics
July 8, 2026
STMicroelectronics unveils world's first ST54M secure mobile chip
STMicroelectronics has introduced the ST54M, a secure mobile chip designed to help smartphone and personal electronics manufacturers meet upcoming quantum-ready ...
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June 22, 2026
STMicroelectronics unveils new compact direct Time-of-Flight 3D LiDAR module
STMicroelectronics announced the launch of the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module that sets a new benchmark in high-resolution sensing. ...
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June 17, 2026
STMicroelectronics' multiplier-less PFC controller enhances cost-sensitive, energy-efficient applications
STMicroelectronics' L6462A transition-mode (TM) power-factor correction (PFC) controller cuts bill-of-materials (BOM) costs while enhancing efficiency, enabling consumer ...
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June 11, 2026
STMicroelectronics expands ST87M01 NB-IoT module platform with certifications for North America and Brazil
STMicroelectronics has completed certification of ST87M01 NB-IoT modules in North America and Brazil, letting IoT projects in both regions leverage the modules' 5G-ready ...
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June 8, 2026
STMicroelectronics' 48V automotive pre-driver combines ISO 21780 compliance with 8-channel flexibility
With an absolute maximum rating (AMR) of 75V, STMicroelectronics’ L98GD8E is the only 48V automotive pre-driver to combine compliance with the ISO 21780 standard ...
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June 2, 2026
STMicroelectronics raises its revenue ambition for Data Centers amidst continued strong demand for AI infrastructure
In light of continued strong AI infrastructure-led demand and based on recent progress made on capacity ramp-up, STMicroelectronics is raising its revenue ambition ...
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May 29, 2026
STMicroelectronics' automotive inertial module boosts positioning and motion sensing accuracy
STMicroelectronics' ASM330LHHG1 automotive-qualified inertial measurement unit (IMU), which operates from -40°C to 125°C, can be mounted in vehicle zones including ...
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May 27, 2026
STMicroelectronics' new GaN semiconductors improve energy efficiency
New gallium nitride (GaN)-based power semiconductors from STMicroelectronics are designed to improve efficiency and increase power density in high-demand applications ...
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May 22, 2026
STMicroelectronics announces enhanced version of industry-proven battery-management IC
STMicroelectronics' L9963F automotive battery-management IC includes all the features needed to manage lithium battery packs in hybrid (HE) and full electric (FE) vehicles, ...
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May 21, 2026
STMicroelectronics' new gate drivers boost economy, performance, and efficiency
STMicroelectronics has introduced new STDRIVE102 gate-driver ICs for three-phase brushless motors, adding the STDRIVE102P and STDRIVE102BP that feature an SPI ...
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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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