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Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
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Press Release
December 15, 2025  -  Click the title to read the full press release.

Malaysia advances semiconductor manufacturing footprint with CHIPX™



CHIPX™ announced plans to establish a state-of-the-art, 8-inch wafer fabrication facility in Malaysia, the first of its kind in the ASEAN region. The facility will introduce advanced ...

CHIPX™
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Handheld Plasma Activation
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