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MicroCircuit-Laboratories-LLC

FSO Hermetic Package HDHS® Technology
Seam sealing with metal to metal seals and low temperature exposure. Inside the hermetic package the atmosphere is precisely controlled. Auer package tooling reduces handling and contamination.
MicroCircuit Laboratories, LLC
Pac-Tech
Press Release
December 5, 2025  -  Click the title to read the full press release.

Q3 2025 GaN Innovation: KnowMade Releases Its Latest Patent Monitor



KnowMade is pleased to announce the release of its Q3 2025 GaN Patent Monitor, providing an in-depth analysis of global intellectual property (IP) activity in the gallium nitride ...

KnowMade
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MRSI

Elevate Efficiency: MRSI-H1 Die Bonder
Transform your assembly with precision and speed. Discover unparalleled quality and efficiency.
MRSI
Plasma-Etch