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FSO Hermetic Package HDHS® Technology
Seam sealing with metal to metal seals and low temperature exposure. Inside the hermetic package the atmosphere is precisely controlled. Auer package tooling reduces handling and contamination.
MicroCircuit Laboratories, LLC
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| Press Release |
December 5, 2025 - Click the title to read the full press release.
Artificial intelligence works fast, but its energy consumption is growing rapidly. A German-Taiwanese research team is now developing a solution: new memory for leading chip ...
Fraunhofer IPMS
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