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FSO Hermetic Package HDHS® Technology
Seam sealing with metal to metal seals and low temperature exposure. Inside the hermetic package the atmosphere is precisely controlled. Auer package tooling reduces handling and contamination.
MicroCircuit Laboratories, LLC
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| Press Release |
December 4, 2025 - Click the title to read the full press release.
The Fraunhofer Institute for Photonic Microsystems IPMS has developed a new key management system (KMS) specifically designed for use in quantum-secure networks. ...
Fraunhofer Institute for Photonic Microsystems IPMS
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