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Pac-Tech

How LAPLACE® Laser Assisted Bonding Saves Energy
LAPLACE® enables fast, localized laser bonding with minimal heat exposure—cutting energy use while ensuring precision for sensitive advanced packaging processes. Watch Demo.
PacTech
Tresky
Press Release
December 4, 2025  -  Click the title to read the full press release.

Key Management System (KMS) for Quantum-Secure Networks



The Fraunhofer Institute for Photonic Microsystems IPMS has developed a new key management system (KMS) specifically designed for use in quantum-secure networks. ...

Fraunhofer Institute for Photonic Microsystems IPMS
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Sponsor
Advanced-Component-Labs

"Build Up" I/C Packages -- USA Fabrication
High layer counts. Low CTE material sets. 20µm Dielectrics /12µm Traces - ITAR Approved - 50um "Stay Flat" Cores. Learn more.
Advanced Component Labs, Inc.
Surfx-Technologies