| Sponsor |
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FSO Hermetic Package HDHS® Technology
Seam sealing with metal to metal seals and low temperature exposure. Inside the hermetic package the atmosphere is precisely controlled. Auer package tooling reduces handling and contamination.
MicroCircuit Laboratories, LLC
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| Press Release |
December 3, 2025 - Click the title to read the full press release.
Indium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). ...
Indium Corporation
March 2, 2026
Indium Corporation Powers the Future With Advanced Materials Solutions at CIPS 2026
As a leading provider of advanced materials solutions for power device packaging, Indium Corporation® will feature its lineup of high-reliability products at CIPS – International ...
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February 26, 2026
Indium Corporation to Present on Indium Oxidation and Its Impact on Precision Applications at SEMI-THERM 2026
Indium Corporation® Product Manager, Engineered Solder Materials (ESM), Jim McCoy, will present techniques to minimize oxidation and improve the thermal conductivity ...
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February 23, 2026
Indium Corporation to Feature High-Performance Thermal Management Solutions at TestConX 2026
As one of the leading providers of high-performance thermal management solutions, Indium Corporation® will feature its lineup of metal thermal interface materials (TIMs) ...
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February 18, 2026
Indium Engineer Examines Key Factors Impacting Improvements in Metal TIMs at TestConX 2026
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2026, taking place March 1-4 in Mesa, Arizona. The session, ...
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January 20, 2026
Indium Corporation to Reinforce Its Leadership in Ag and Cu Pressure Sinter Solutions at NEPCON Japan 2026
Indium Corporation® will feature its highly versatile InFORCE® series of pressure sinter paste at NEPCON Japan 2026, January 21-23, in Tokyo. The company will showcase ...
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January 14, 2026
Indium Corporation Brings Precision Au-Based Die-Attach Preforms to SPIE Photonics West
Indium Corporation® will showcase its high-reliability, Au-based precision die-attach preforms for critical laser applications at SPIE Photonics West, January 20-22, in San Francisco ...
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December 3, 2025
Indium Expert to Tackle Reliability Challenges in AI at EPTC 2025
Indium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). ...
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December 1, 2025
Indium Corporation to Share Expertise on Thermal Interface Materials at Upcoming INEMI Webinar
A technical presentation on thermal interface materials (TIMs) will be featured at an upcoming webinar organized by the International Electronics Manufacturing Initiative ...
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November 17, 2025
Indium Corporation to Feature Thermal Materials Solutions for High-Performance Computing at SC25
As one of the leading providers of high-performance thermal materials solutions, Indium Corporation® is proud to feature its lineup of metal thermal interface materials and ...
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November 12, 2025
Indium Corporation is Electrifying the Future with Advanced Materials Solutions at Productronica
As one of the leading providers in advanced materials solutions for power device packaging and materials for the electronics assembly and solder industries, Indium ...
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