| Sponsor |
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Die-on-Tab for Compound Semiconductors
This white paper explains why die-on-tab is critical for GaN and GaAs RF power devices, improving heat dissipation, reliability, and system life. Download now.
StratEdge Corporation
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| Press Release |
December 4, 2025 - Click the title to read the full press release.
STMicroelectronics' TSC240 is a high-precision current-sense amplifier with elevated voltage tolerance and 120dB PWM rejection for accurate and reliable monitoring in ...
STMicroelectronics
April 21, 2026
STMicroelectronics reveals high-precision op amps for 4V-36V range
STMicroelectronics' TSB192 dual op amps deliver very high precision for applications that need a wide operating-voltage range, with offset voltage of 20µV, temperature drift ...
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April 6, 2026
STMicroelectronics' fast-switching GaN drivers add smart protection for motion control and power conversion
STMicroelectronics has announced two new high-speed half-bridge gate drivers that bring gallium-nitride (GaN) efficiency, thermal performance, and miniaturization to a broad ...
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April 1, 2026
STMicroelectronics' low-resistance MOSFETs save energy and PCB area
STMicroelectronics has introduced a series of low-RDS(on) MOSFETs made with new Smart STripFET F8 technology, which is engineered for optimum conduction performance ...
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March 31, 2026
Power management optimized ICs for STM32 microprocessors in industrial applications
STMicroelectronics' STPMIC1L and STPMIC2L power-management ICs (PMICs) help designers leverage the embedded-processing muscle of ST's Arm® Cortex®-A microprocessors ...
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March 23, 2026
STMicroelectronics' GaN reference design targets motor-control applications
STMicroelectronics' EVSTDRVG611MC gallium-nitride (GaN) motor-control reference design for appliances and industrial drives handles more than 600W without a heatsink, ...
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March 18, 2026
STMicroelectronics' single-chip buck converter packs 3A power for appliances, industrial loads
Capable of supplying 3A from a 3mm x 1.6mm footprint, STMicroelectronics' DCP3603 monolithic buck converter simplifies design, saves PCB space, accelerates time to market ...
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March 17, 2026
STMicroelectronics and Leopard Imaging accelerate robotics vision with NVIDIA Jetson-ready multi-sensor module
STMicroelectronics and Leopard Imaging® have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining ST imaging, ...
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March 11, 2026
STMicroelectronics accelerates AI-enhanced motor control with machine-learning software pack
STMicroelectronics has released motor-control software to simplify enhancing drives with AI for optimization and predictive maintenance, ready to load on the EVLSPIN32G4-ACT ...
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March 10, 2026
STMicroelectronics enters high-volume production of its silicon photonics platform
STMicroelectronics is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for ...
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March 4, 2026
STMicroelectronics' sensor and secure wireless technologies support Snapdragon Wear Elite
STMicroelectronics now supports leading-edge motion-sensing and secure wireless technologies on Qualcomm Technologies' newly launched personal AI platform, Snapdragon ...
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Proven Flip-Chip Flux for AI Packages
WS-641 is a proven high-performance flip-chip flux for 2.5D packaging, trusted by leading OSATs to deliver consistent results & reliability in advanced CoW applications.
Indium Corporation
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