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Sponsor
MicroCircuit-Laboratories-LLC

FSO Hermetic Package HDHS® Technology
Seam sealing with metal to metal seals and low temperature exposure. Inside the hermetic package the atmosphere is precisely controlled. Auer package tooling reduces handling and contamination.
MicroCircuit Laboratories, LLC
Pac-Tech
Press Release
December 4, 2025  -  Click the title to read the full press release.

NanoGlue as a key technology for photonics and quantum computing



In modern photonics manufacturing, the precise alignment and permanent fixation of optoelectronic components plays a central role. Especially when assembling laser diodes ...

nanosystec GmbH
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Sponsor
MRSI

Elevate Efficiency: MRSI-H1 Die Bonder
Transform your assembly with precision and speed. Discover unparalleled quality and efficiency.
MRSI
Plasma-Etch