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FSO Hermetic Package HDHS® Technology
Seam sealing with metal to metal seals and low temperature exposure. Inside the hermetic package the atmosphere is precisely controlled. Auer package tooling reduces handling and contamination.
MicroCircuit Laboratories, LLC
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| Press Release |
December 3, 2025 - Click the title to read the full press release.
Brewer Science, Inc. will co present two technical papers with imec at the IEEE Electronics Packaging Technology Conference (EPTC) in Singapore, December 2–5, 2025. ...
Brewer Science
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