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Pac-Tech

How LAPLACE® Laser Assisted Bonding Saves Energy
LAPLACE® enables fast, localized laser bonding with minimal heat exposure—cutting energy use while ensuring precision for sensitive advanced packaging processes. Watch Demo.
PacTech
Tresky
Press Release
December 3, 2025  -  Click the title to read the full press release.

imec and Brewer Science to Co-Present Breakthroughs at EPTC



Brewer Science, Inc. will co present two technical papers with imec at the IEEE Electronics Packaging Technology Conference (EPTC) in Singapore, December 2–5, 2025. ...

Brewer Science
December 3, 2025
imec and Brewer Science to Co-Present Breakthroughs at EPTC
Brewer Science, Inc. will co present two technical papers with imec at the IEEE Electronics Packaging Technology Conference (EPTC) in Singapore, December 2–5, 2025. ...
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Sponsor
Advanced-Component-Labs

"Build Up" I/C Packages -- USA Fabrication
High layer counts. Low CTE material sets. 20µm Dielectrics /12µm Traces - ITAR Approved - 50um "Stay Flat" Cores. Learn more.
Advanced Component Labs, Inc.
Surfx-Technologies