semiconductor
packaging news
Sponsor
XYZTEC

High Force and Large area bond tester
The most powerful bond tester to test IGBTs, power modules and large batteries up to 1000 kgf. Sigma HF/L offers flexible positioning and operates with the fastest axis speed. Learn more.
xyztec
Ontos-Equipment-Systems
Press Release
November 17, 2025  -  Click the title to read the full press release.

Eutect presents simple teach-in mode for collaborative robot soldering



At productronica, Eutect GmbH will present its Multiple Process Changer (MPC) soldering system, which performs fully automated piston soldering using Mitsubishi's MELFA ...

Eutect GmbH
November 17, 2025
Eutect presents simple teach-in mode for collaborative robot soldering
At productronica, Eutect GmbH will present its Multiple Process Changer (MPC) soldering system, which performs fully automated piston soldering using Mitsubishi's MELFA ...
July 29, 2025
Cradle-to-Cradle is succeeding in mechanical engineering
Sustainability is a hot topic for many mechanical engineering companies. At EUTECT GmbH, however, it has been an integral part of the company and product strategy for years.  ...
May 8, 2024
Zollner Elektronik AG relies on energy-efficient and cycle time-optimized alternative to thermode soldering
The Laser Knife developed by Eutect enables optimum results when soldering flex foils, cable strands, ribbon cables and battery pins. The Laser Knife soldering process is characterized ...
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
StratEdge-Corporation

Die Attach Material Comparisons
Packaging high-power GaN devices? This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn. Revolutionize GaN efficiency/reliability.
StratEdge Corporation
ZEISS